Process for dielectric stenciled microcircuits

Details Process for dielectric stenciled microcircuits Process for dielectric stenciled microcircuits

1981-03-12

1982-06-22

Brown, L. Travis

Radiation imagery chemistry: process, composition, or product th

Visible imaging including step of firing or sintering

430317, 430330, 427 96, G03C 700

Patent

active

043363202

ABSTRACT:
The present invention is directed to a process for complex, high density microcircuits in which thick film dielectric pastes are photolithography patterned into high resolution stencils to produce complementary conductor circuitry patterns, the voids of the developed dielectric stencil are filled with thick film conductor paste, and then there is a cofiring of the conductor and the dielectric. With this new process the number of separate firing operations is reduced. The reduction in the number of firings is important in multilevel hybrid structures.

REFERENCES:
patent: 3443944 (1969-05-01), Wise
patent: 3982941 (1976-09-01), Inskip
patent: 4119480 (1978-10-01), Nishi et al.

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