Process for determining the plating activity of an electroless p

Chemistry: electrical and wave energy – Processes and products

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

204400, 204412, 204434, G01N 2746

Patent

active

046541268

ABSTRACT:
A process for monitoring an electroless plating bath to determine whether it is in a take mode by electrolessly depositing a film of the metal of the plating bath onto a substrate to provide a preplated cathode; providing the cathode, a reference electrode, and an anode in the electroless bath; passing an electric current and varying the voltage difference, plotting the voltage difference versus the current; and comparing the oxidation peak of the reducing agent to the oxidation peak of the reduced state of the metal ion to be plated to thereby determine whether the bath is in a take mode.

REFERENCES:
patent: 2938805 (1960-05-01), Agens
patent: 2996408 (1961-08-01), Lukes
patent: 3075855 (1963-01-01), Agens
patent: 3075856 (1963-01-01), Lukes
patent: 3844799 (1974-10-01), Underkofler et al.
patent: 3925168 (1975-12-01), Costas
patent: 4096301 (1978-06-01), Slominski et al.
patent: 4132605 (1979-01-01), Tench et al.
patent: 4146437 (1979-03-01), O'Keefe
patent: 4152467 (1979-05-01), Alpaugh et al.
patent: 4182638 (1980-01-01), Cooke
patent: 4276323 (1981-06-01), Oka et al.
patent: 4286965 (1981-09-01), Vanhumbeeck et al.
patent: 4287027 (1981-09-01), Tosk
patent: 4324621 (1982-04-01), Kerby
patent: 4336111 (1982-06-01), Graunke
"Control of Contaminants in Copper Pyrophosphate Circuit Board Production Baths", Ogden, et al., Plating and Surface Finishing, Dec. 1979, pp. 45-46.
Paunovic, "An Electrochemical Control System for Electroless Copper Bath", Journal Electrochemical Society, Electrochemical Science and Technology, vol. 127, No. 2, pp. 365-369.
Mantell, et al., "Current-Potential Effects of Trace Impurities in Manganese Electrowinning", Transactions of the Metallurgical Society of AIME, vol. 236, May 1966, pp. 718-725.
Vennesland, et al., "Current-Potential Effects of Trace Impurities in Zinc Sulfate Electrolyte", Acta Chemica Scandinavica, 27, 1973, No. 3, pp. 846-850.
Mansfeld, "The Copper Plating Bath Monitor", Plating and Surface Finishing, May 1978, pp. 60-62.
Haddad, IBM Technical Disclosure Bulletin, vol. 19, No. 11, Apr. 1977, p. 4156.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for determining the plating activity of an electroless p does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for determining the plating activity of an electroless p, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for determining the plating activity of an electroless p will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2211605

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.