Coating processes – Electrical product produced
Reexamination Certificate
2007-09-26
2010-12-28
Chen, Bret (Department: 1715)
Coating processes
Electrical product produced
C427S064000, C427S066000, C427S255600, C117S088000, C117S098000
Reexamination Certificate
active
07858144
ABSTRACT:
A process of making an organic thin film on a substrate by atomic layer deposition is disclosed, the process comprising simultaneously directing a series of gas flows along substantially parallel elongated channels, and wherein the series of gas flows comprises, in order, at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material, optionally repeated a plurality of times, wherein the first reactive gaseous material is capable of reacting with a substrate surface treated with the second reactive gaseous material wherein the first reactive gaseous material, the second reactive gaseous material or both is a volatile organic compound. The process is carried out substantially at or above atmospheric pressure and at a temperature under 250° C., during deposition of the organic thin film.
REFERENCES:
patent: 4413022 (1983-11-01), Suntola et al.
patent: 6316098 (2001-11-01), Yitzchaik et al.
patent: 6808803 (2004-10-01), Yitzchaik
patent: 6821563 (2004-11-01), Yudovsky
patent: 7572686 (2009-08-01), Levy et al.
patent: 2002/0106451 (2002-08-01), Skarp et al.
patent: 2003/0124457 (2003-07-01), Jung et al.
patent: 2003/0232511 (2003-12-01), Metzner et al.
patent: 2005/0084610 (2005-04-01), Selitser
patent: 2005/0112874 (2005-05-01), Skarp et al.
patent: 2006/0017383 (2006-01-01), Ishida et al.
patent: 2006/0244107 (2006-11-01), Sugihara et al.
patent: 2007/0077349 (2007-04-01), Newman et al.
patent: 2007/0190247 (2007-08-01), Jang et al.
patent: 2008/0100202 (2008-05-01), Cok
patent: 2008/0102313 (2008-05-01), Nilsen et al.
patent: 2008/0290787 (2008-11-01), Cok
patent: 2010/0092696 (2010-04-01), Shinriki et al.
patent: WO 2007/106788 (2007-09-01), None
Ritala, Mikko, et al., “Atomic Layer Deposition of Oxide Thin Films with Metal Alkoxides as Oxygen Sources”. Science, vol. 288, Apr. 14, 2000, pp. 319-321.
Ghosh, A.P., et al., “Thin-film encapsulation of organic light-emitting devices”. Applied Physics Letters, 86, 223503-1 to 223503-3 (2005).
Lli, Zhengwen, et al., “Atomic Layer Deposition of Ultrathin Copper Metal Films from a Liquid Copper(I) Amidinate Precursor”. Journal of The Electrochemical Society, 153 (11) C787-C794 (2006).
Chongmu Lee, et al., “dependence of the electrical properties of the ZnO thin films grown by atomic layer epitaxy on the reactant feed sequence,” J. Vac. Sci. Technol. A 24(4), Jul./Aug. 2006, pp. 1031-1035.
Matti Putkonen, et al., “Atomic Layer Deposition of Polyimide Thin Films,” Journal of Materials Chemistry, 2007, 17, 664-669.
A. A. Dameron, “Molecular Layer Deposition of Alucone Polymer Films Using Trimethylaluminum and Various Gyols” (Abstract) to be presented Oct. 15, 2007 at the AVS 54thInternational Symposium, (Paper TF-MoA8).
Tetsuzo Yoshimura, et al., “Polymer Films Formed With Monolayer Growth Steps by Molecular Layer Depositon,” Appl. Phys. Lett., vol. 59, No. 4, Jul. 1991, pp. 482-484.
Cowdery-Corvan Peter J.
Freeman Diane C.
Levy David H.
Chen Bret
Eastman Kodak Company
Konkol Chris P
Tucker J. Larry
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