Process for depositing an adherent silver film

Details Process for depositing an adherent silver film Process for depositing an adherent silver film

1989-08-16

1991-05-28

Pianalto, Bernard

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

204 19, 204 20, 204 23, 204 49, 204 521, 427124, 427125, 427253, 4272551, 427404, 4274431, B05D 306

Patent

active

050194151

ABSTRACT:
The process for depositing an adherent silver film, especially on a nonconducting substrate, involves depositing the silver film from the gas phase. A plasma discharge in a gas containing volatile silver organic compounds is used. The silver compounds advantageously contain silver atoms which are bonded to an sp.sup.2 -hybridized carbon atom and are halogen-containing, particularly fluorine-containing compounds. The compounds CF.sub.3 --CAg.dbd.CF--CF.sub.3, CF.sub.3 --CAg.dbd.CF.sub.2 and pentafluorophenyl silver may be used. The silver film so formed may be strengthened electrochemically or by chemical reduction. The silver film products are useful as electrically conducting, decorative or reflective layers.

REFERENCES:
patent: 2501563 (1950-03-01), Colbert et al.
patent: 3087838 (1963-04-01), Lubin
patent: 4226896 (1980-10-01), Coburn et al.

Affiliated with

Also associated with

Rating

Process for depositing an adherent silver film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for depositing an adherent silver film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for depositing an adherent silver film will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-35264