Process for depositing a layer of material on a substrate

Details Process for depositing a layer of material on a substrate Process for depositing a layer of material on a substrate

2008-01-29

2008-01-29

Tsang-Foster, Susy (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

C205S096000, C205S103000, C205S123000, C205S128000, C205S145000, C205S157000, C205S223000

Reexamination Certificate

active

10218810

ABSTRACT:
An electroplating system (30) and process makes electrical current density across a semiconductor device substrate (20) surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material. The electrical current density modifiers (364and37) reduce the electrical current density near the edge of the substrate (20). By reducing the current density near the edge of the substrate (20), the plating becomes more uniform or can be tailored so that slightly more material is plated near the center of the substrate (20). The system can also be modified so that the material that plates on electrical current density modifier portions (364) of structures (36) can be removed without having to disassemble any portion of the head (35) or otherwise remove the structures (36) from the system. This in-situ cleaning reduces the amount of equipment downtime, increases equipment lifetime, and reduces particle counts.

REFERENCES:
patent: 2751340 (1956-06-01), Schaefer et al.
patent: 2859166 (1958-11-01), Grigger
patent: 3880725 (1975-04-01), Van Raalte et al.
patent: 4148707 (1979-04-01), Mayer et al.
patent: 4304641 (1981-12-01), Grandia et al.
patent: 4420382 (1983-12-01), Riedl
patent: 4421627 (1983-12-01), LeBaron
patent: 4466864 (1984-08-01), Bacon et al.
patent: 4678545 (1987-07-01), Galik
patent: 4720329 (1988-01-01), Sirbola
patent: 4879007 (1989-11-01), Wong
patent: 5084153 (1992-01-01), Mosse et al.
patent: 5135636 (1992-08-01), Yee et al.
patent: 5149419 (1992-09-01), Sexton et al.
patent: 5230743 (1993-07-01), Thompson et al.
patent: 5312532 (1994-05-01), Andricacos et al.
patent: 5332487 (1994-07-01), Young, Jr. et al.
patent: 5582708 (1996-12-01), Delfrate et al.
patent: 5620581 (1997-04-01), Ang
patent: 5662788 (1997-09-01), Sandhu et al.
patent: 5723028 (1998-03-01), Poris
patent: 19547948 (1995-12-01), None
patent: 0500513 (1992-08-01), None
patent: 0666343 (1995-08-01), None
patent: 2089838 (1982-06-01), None
patent: 5412845 (1979-10-01), None
patent: WO87/07654 (1987-12-01), None
Rousselot, “Current-Distribution Improving Aids,” Metal Finishing, Mar. 1961, pp. 57-63.
Lowenheim, “Electroplating,” American Electroplaters' Society, Jan. 8, 1979, pp. 152-163 and pp. 363-377.

Affiliated with

Also associated with

Rating

Process for depositing a layer of material on a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for depositing a layer of material on a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for depositing a layer of material on a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3905661