Process for depositing a layer of material on a substrate

Details Process for depositing a layer of material on a substrate Process for depositing a layer of material on a substrate

2008-01-29

2008-01-29

Tsang-Foster, Susy (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

C205S096000, C205S103000, C205S123000, C205S128000, C205S145000, C205S157000, C205S223000

Reexamination Certificate

active

07323094

ABSTRACT:
An electroplating system (30) and process makes electrical current density across a semiconductor device substrate (20) surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material. The electrical current density modifiers (364and37) reduce the electrical current density near the edge of the substrate (20). By reducing the current density near the edge of the substrate (20), the plating becomes more uniform or can be tailored so that slightly more material is plated near the center of the substrate (20). The system can also be modified so that the material that plates on electrical current density modifier portions (364) of structures (36) can be removed without having to disassemble any portion of the head (35) or otherwise remove the structures (36) from the system. This in-situ cleaning reduces the amount of equipment downtime, increases equipment lifetime, and reduces particle counts.

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