Process for depositing a copper containing layer I

Details Process for depositing a copper containing layer I Process for depositing a copper containing layer I

1991-07-26

1994-09-13

Bell, Janyce

Coating processes

Direct application of electrical, magnetic, wave, or...

Photoinitiated chemical vapor deposition

427586, 427109, 4271262, 4271263, 427252, 427253, 4272552, 4272553, 4272557, 427294, 427295, 427322, 427404, 4274192, 556 19, 556 20, 556 21, 556 26, 556 37, 556113, 556116, B05D 306

Patent

active

053467302

ABSTRACT:
The deposition of a copper-containing layer on a substrate by decomposing, particularly by a CVD process, a compound corresponding to the formula (I)

REFERENCES:
patent: 3251712 (1966-05-01), Berger
patent: 3256109 (1966-06-01), Berger
patent: 3352707 (1967-11-01), Pichard
patent: 3549412 (1970-12-01), Frey et al.
patent: 3594326 (1971-07-01), Charles et al.
patent: 3674541 (1972-07-01), Ichiki et al.
patent: 3978272 (1976-08-01), Donley
patent: 4666742 (1987-05-01), Takahora et al.
patent: 4830880 (1989-05-01), Okubi
patent: 4833103 (1989-05-01), Agostinelli
patent: 4880670 (1989-11-01), Erbil
Schmutzler, Inorganic Chemistry, 3:415-21 (1964).
Schmutzler, Organic Syntheses, 45:99-101 (1965).
Fild et al., J. Chem. Soc.(A), 1970:2359-64 (1970).
Tsuda et al., J.A.C.S. 94:658-59 (1972).
Tsuda et al., J.A.C.S. 96:5930-31 (1974).
Tsuda et al., Inorganic Chemistry 15:2329-32 (1976).
Houle et al., Appl. Phys. Lett., 46:204-06 (1985).
Jeffries et al., Chem. Mater., 1989:8-10 (1989).
Hampden-Smith, Chem. Mater., 1990:636-39 (1990).

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