Process for cutting or shaping of a substrate by laser

Details Process for cutting or shaping of a substrate by laser Process for cutting or shaping of a substrate by laser

1977-12-19

1979-10-02

Truhe, J. V.

Electric heating

Metal heating

By arc

B23K 900

Patent

active

041699769

ABSTRACT:
A process for cutting or shaping of a ceramic substrate with laser light, comprising pulsing the laser light and moving the pulsing laser light source with respect to the substrate so that individual light pulses strike different spots along the substrate, defining a path; the laser light may pierce the substrate.

REFERENCES:
patent: 2989614 (1961-06-01), Steigerwald
patent: 3588440 (1971-06-01), Morse
patent: 3612814 (1971-10-01), Houldcroft

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