Process for curing of adhesives for flocking and texturing on he

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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156 72, 156272, 156279, 427206, 428 90, 428 95, 428 96, B05D 114, B05D 116

Patent

active

041003110

ABSTRACT:
The disclosure herein is concerned with critical electron-beam radiation parameters and beam-passage rates and adjustments that have been found to enable high-speed curing of adhesives used to bond flock and similar materials to heat-sensitive substrates that otherwise inherently limit the degree of thermal curing that may be employed as by other means, and consequently limit the speed of curing.

REFERENCES:
patent: 2668133 (1954-02-01), Brophy et al.
patent: 3262128 (1966-07-01), Morgan et al.
patent: 3661691 (1972-05-01), Slosberg
patent: 3903331 (1975-09-01), Klein

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