Process for creating metal-insulator-metal devices

Details Process for creating metal-insulator-metal devices Process for creating metal-insulator-metal devices

2006-05-09

2006-05-09

Everhart, Caridad (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S431000

Reexamination Certificate

active

07042057

ABSTRACT:
A process is described for fabricating an active addressing component such as a metal-insulator-metal (MIM) device by creating surface relief levels to form trenches, and depositing a metal in the trenches. The metal is anodized to create a non-linear dielectric. A second metal is deposited in the trenches to create an electrical with the dielectric which a contact is provided, and transferring the MIM device to a substrate by adhesive transfer.

REFERENCES:
patent: 6243062 (2001-06-01), den Boer et al.
patent: 2002/0093601 (2002-07-01), Inoue et al.

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