Process for copper plating a wiring board

Details Process for copper plating a wiring board Process for copper plating a wiring board

1995-06-01

1996-07-23

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205187, 205213, C25D 500

Patent

active

055386164

ABSTRACT:
An electroless nickel plating is used as a primer for electroplating of copper. Preferably, electroless nickel plating is conducted after the surface of aluminum is subjected to nickel substitution with a nickel salt under a strongly acidic condition (pH: 1 or less). More preferably, the nickel substitution is carried out after the oxide film on the surface of aluminum is removed.

REFERENCES:
patent: 2694017 (1954-11-01), Reschan et al.
patent: 3726771 (1973-04-01), Coll-Palagos
patent: 3781596 (1973-12-01), Galli
patent: 4713494 (1987-12-01), Oikawa

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