Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1983-03-08
1985-10-08
Gallagher, John J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29589, 65 43, 156325, 1563309, B32B 3100
Patent
active
045458405
ABSTRACT:
A semiconductor die attach adhesive is provided which is formed of a plurality of spacers formed in a suspension of silver filled glass. In one embodiment of this invention, the spacers are spheres. The spacers utilized in one embodiment of this invention have a melting temperature below the temperature at which the solvents are evaporated from the die attach adhesive. In this manner, as the solvents are driven from the silver filled glass during the die attach operation, thus causing the volume of the silver filled glass to decrease, the spacers utilized in this invention partially melt, thus decreasing their thickness. This decreased thickness of the spacers decreases the separation between the die and the substrate, thus preventing the formation of voids within the die attach adhesive. In one embodiment, the spacers are formed of a lead/tin alloy. In another embodiment of this invention, the spacers are formed of a lead/tin/bismuth alloy, and in yet another embodiment of this invention the spacers are formed of lead/tin/bismuth eutectic.
REFERENCES:
patent: 2335615 (1943-11-01), Strasser
patent: 3406053 (1968-10-01), Jaenicke
patent: 3655482 (1972-04-01), Schildkraut et al.
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 3923581 (1975-12-01), Payne et al.
patent: 4083718 (1978-04-01), Murabayashi et al.
patent: 4129881 (1978-12-01), Reichel et al.
patent: 4157273 (1979-06-01), Brady
Johnson Fred
Newman Robert
Caserza Steven F.
Gallagher John J.
MacDonald Thomas S.
MacPherson Alan H.
Monolithic Memories Inc.
LandOfFree
Process for controlling thickness of die attach adhesive does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for controlling thickness of die attach adhesive, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for controlling thickness of die attach adhesive will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2218174