Radiation imagery chemistry: process – composition – or product th – Including control feature responsive to a test or measurement
Reexamination Certificate
2007-07-10
2007-07-10
Young, Christopher G. (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Including control feature responsive to a test or measurement
C430S296000, C430S942000, C716S030000
Reexamination Certificate
active
11165312
ABSTRACT:
A process for controlling the proximity effect correction in an electron beam lithography system. The exposure is controlled in order to obtain resulting pattern after processing which is conform to design data. In a first step an arbitrary set patterns is exposed without applying the process for controlling the proximity correction. The geometry of the resulting test structures is measured and a set of measurement data is obtained. Within a numerical range basic input parameters for the parameters α, β and η, are derived from the set of measurement data. A model is fitted by individually changing at least the basic input parameters α, β and η of a control function to measurement data set and thereby obtaining an optimised set of parameters. The correction function is applied to an exposure control of the electron beam lithography system during the exposure of a pattern according to the design data.
REFERENCES:
patent: 5432714 (1995-07-01), Chung et al.
patent: 0 813 231 (1997-12-01), None
Cui, Zheng, et al., “Proximity Correction of Chemically Amplified Resists for Electron Beam Lithography,” Microelectronic Engineering 41/42 (1998) pp. 183-186.
Simecek, Michal, et al., “A New Approach of E-beam Proximity Effect Correction for High-Resolution Applications,” JPN. J. Appl. Phys., vol. 37 (1998) pp. 6774-6778.
Yang, Seung-Hune, et. al., “Fogging Effect Consideration in Mask Process at 50KeV E-Beam Systems,” Proc. of SPIE, vol. 4889 (2002), pp. 786-791.
Stevens, L., et al., “Determination of the Proximity Parameters in Electron Beam Lithography Using Doughnut-Structures,” Microelectronic Engineering 5 (1986) pp. 141-150.
Park, Eui Sang, et al., “Optimum PEC Conditions Under Resist Heating Effect Reduction for 90nm Node Mask Writing,” Proc. SPIE, vol. 4889, Part Two, pp. 792-799.
Rishton, S.A., et al., “Point exposure distribution measurements for proximity correction in electron beam lithography on a sub-100nm scale,” Journal of Vacuum Science & Technology B (Microelectronics Processing and Phenomena) USA, vol. 5, No. 1, pp. 135-141.
Misaka, Akio, et al., “Determination of Proximity Effect Parameters in Electron-Beam Lithography,” J. Appl. Physics, vol. 68, No. 12, Dec. 15, 1990, pp. 6472-6479.
Vermeulen, P., et al., “Proximity-Effect Correction in Electron-Beam Lithography,” Journal of Vacuum Science & Technology B (1989) Nov./Dec., No. 6, NY, pp. 1556-1560.
Harafuji, Kenji, et al., “Proximity Effect Correction Data Processing System for Electron Beam Lithography,” Journal of Vacuum Science & Technology B, vol. 10, No. 1, 1992, pp. 133-142.
Beyer Dirk
Hudek Peter
Leica Microsystems Lithography GmbH
Young Christopher G.
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