Metal fusion bonding – Process – Plural joints
Patent
1988-06-09
1989-11-07
Godici, Nicholas P.
Metal fusion bonding
Process
Plural joints
228245, 228246, B23K 3102
Patent
active
048786110
ABSTRACT:
A solder joint assembly technique applies controlled volumes of solder to pads of both package and substrate. The two units are positioned adjacent each other with the pads and solder deposits mechanically maintained in registration with each other. The assembly is reflowed and the final separation between package and substrate at which the resulting solder joint solidifies is mechanically controlled in order to control a geometry of the resultant solidified joint. The solder volume deposits may assume various forms including spherical bumps and solder paste deposits.
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LoVasco Francis
Oien Michael A.
American Telephone and Telegraph Company AT&T Bell Laboratories
Andes William Scott
Godici Nicholas P.
Steinmetz Alfred G.
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