Process for controlling of chemical copper plating solution

Details Process for controlling of chemical copper plating solution Process for controlling of chemical copper plating solution

1979-12-21

1981-06-30

Kendall, Ralph S.

Coating processes

Measuring, testing, or indicating

427306, 427345, 4274431, 427437, 106 123, 324438, 324 71R, 204 1T, C23C 302

Patent

active

042763231

ABSTRACT:
A concentration of copper ions, a concentration of a reducing agent, a concentration of a complexing agent and a pH of a chemical copper plating solution are continuously detected all as potentials, and continuously controlled with a good accuracy.

REFERENCES:
patent: 3532519 (1970-10-01), Hirohata et al.
patent: 3951602 (1976-04-01), Thompson
patent: 4096301 (1978-06-01), Slominski et al.

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