Process for controlling mobile ion contamination in semiconducto

Metal working – Method of mechanical manufacture – Assembling or joining

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29571, 148 15, 148187, 148DIG24, 148DIG61, 357 91, H01L 2120, B01J 1700

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active

046793089

ABSTRACT:
The present invention provides a method of protecting semiconductor integrated circuit from mobile ion contamination. In one embodiment a gettering agent is implanted into a dielectric layer. In an alternative embodiment a gettering agent is implanted into a photoresist layer which is ashed in an oxygen based plasma, leaving the gettering agent on the surface underlying the photoresist.

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