Process for controlling a bonding gas system

Details Process for controlling a bonding gas system Process for controlling a bonding gas system

1976-09-17

1977-12-27

Padgett, Benjamin R.

Compositions

Compositions containing a single chemical reactant or plural...

Organic reactant

156181, 156290, 156306, 252372, 423240, 423481, C09K 300

Patent

active

040653994

ABSTRACT:
A process for controlling a bonding gas system is disclosed. The process controls temperature and composition of an activating gas used for bonding a nonwoven web of continuous nylon filaments and for supplying the gas to a gas box at a temperature just above its dew-point. A monitored concentration of liquid HCl, maintained at a predetermined temperature, is supplied to a stripper column; an HCl-water-air mixture which contains a low volume percent of HCl is circulated through the stripper column so that the mixture evaporates a portion of the liquid HCl wherein the volume percent of HCl in the mixture is increased thereby forming a bonding gas having the desired HCl concentration; the temperature of the gas leaving the stripper column is controlled so that the HCl concentration of the gas is just above its dew-point and then the gas is fed into a gas box.

REFERENCES:
patent: 1906467 (1933-05-01), Heath
patent: 3174873 (1965-03-01), Callow et al.
patent: 3542615 (1970-11-01), Dobo et al.
patent: 3676244 (1972-07-01), Kim
patent: 3705068 (1972-12-01), Dobo et al.

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