Process for contacting and interconnecting semiconductor devices

Details Process for contacting and interconnecting semiconductor devices Process for contacting and interconnecting semiconductor devices

1990-05-18

1991-12-03

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437192, 437194, 437200, 357 71, H01L 2144

Patent

active

050700367

ABSTRACT:
An improved structure and process for contacting and interconnecting semiconductor devices within a VLSI integrated circuit are described. The structure includes several regions which cooperate to provide (1) contacts of low electrical resistance to semiconductor device terminals, (2) barriers to unwanted metallurgic reactions, (3) strong bonds between major regions of the structure, (4) overall mechanical strength, (5) a primary current path of low electrical resistance, (6) a secondary current path in parallel with the primary current path, and (7) circuit bond pads for use in making electrical connections to the VLSI circuit. Because of the structure's mechanical strength, semiconductor devices may be placed beneath circuit bond pads. The inventive process facilitates accurate control of the composition and thickness of each of the several regions within the material structure.

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