Process for connecting circuits and adhesive film used therefor

Details Process for connecting circuits and adhesive film used therefor Process for connecting circuits and adhesive film used therefor

1992-03-20

1998-12-01

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29832, 156295, 156305, 1563069, 156330, 437212, 437226, 523206, 523211, 525523, B32B 3100

Patent

active

058432515

ABSTRACT:
An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.

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patent: 3764436 (1973-10-01), Schmidt et al.
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patent: 4356505 (1982-10-01), Lovinger et al.
patent: 4423435 (1983-12-01), Test, II
patent: 4469553 (1984-09-01), Whitehead
patent: 4617357 (1986-10-01), Pallie et al.
patent: 4749120 (1988-06-01), Hatada

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