Process for connecting circuits and adhesive film used therefor

Details Process for connecting circuits and adhesive film used therefor Process for connecting circuits and adhesive film used therefor

1995-06-05

2000-09-05

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29832, 156281, 156305, 1563069, 156330, 437183, 523206, 523211, 525523, B32B 3100, C09J 510

Patent

active

061137286

ABSTRACT:
An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.

REFERENCES:
patent: 3167602 (1965-01-01), Bentov et al.
patent: 3600246 (1971-08-01), Breen
patent: 3741858 (1973-06-01), Fujiwara et al.
patent: 3811183 (1974-05-01), Celling
patent: 4617357 (1986-10-01), Pallie et al.
patent: 4749120 (1988-06-01), Hatada

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