Process for compensating for the position of a camera in a chip

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29721, 29740, 29743, 29834, 294 641, 356394, 382151, H05K 332, H05K 1304, H05K 1308

Patent

active

057298955

ABSTRACT:
Disclosed is a process for mounting chips exactly on a PCB without making a camera coordinate system coincide with a table coordinate system of a rotary-type chip mount system. The process comprises the steps of reading positional difference and angular difference between a camera coordinate system and a table coordinate system as values in the camera coordinate system by means of a jig nozzle, transforming the values to those of the table coordinate system, and using the transformed values as compensation data when mounting chips on PCB.

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patent: 5383270 (1995-01-01), Iwatsuka et al.
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patent: 5570993 (1996-11-01), Onodera et al.

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