Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Reexamination Certificate
2007-04-26
2010-11-23
Brewster, William M. (Department: 2823)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Thinning of semiconductor substrate
C438S737000, C438S752000, C438S753000
Reexamination Certificate
active
07838393
ABSTRACT:
The invention relates to a process for collective manufacturing of cavities and/or membranes (24), with a given thickness d, in a wafer said to be a semiconductor on insulator layer, comprising at least one semiconducting surface layer with a thickness d on an insulating layer, this insulating layer itself being supported on a substrate, this process comprising:etching of the semiconducting surface layer with thickness d, the insulating layer forming a stop layer, to form said cavities and/or membranes in the surface layer.
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Collet Joel
Nicolas Stephane
Pisella Christian
Brewster William M.
Nixon & Peabody LLP
Tronic's Microsystems
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