Process for coating or bonding electronic components and subasse

Coating processes – With post-treatment of coating or coating material – Heating or drying

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427 96, 427558, 427559, B05D 100

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active

052427153

ABSTRACT:
In a process for coating or bonding electronic components and subassemblies with reaction resin mixtures that are stable in storage at room temperature as a one-component system for several months, reaction resin mixtures are used, which contain the following components:

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