Process for coating electronic components hybridized by bumps on

Fishing – trapping – and vermin destroying

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437211, 29841, H01L 2144

Patent

active

054967694

ABSTRACT:
The invention relates to a process for coating electronic components mounted on a substrate using a bump or ball hybridization method. It also relates to the coated electronic component obtained by performing this process. The process comprises placing bumps on the substrate, around an electronic component in order to form a bump belt or carpet contiguous with said electronic component and depositing at least one drop of a coating substance on said bump belt, the bumps of the belt impregnated with the substance being able to make said substance migrate by capillarity towards the bumps located between said electronic component and said substrate. The invention has applications in microelectrics, data processing and optoelectronics.

REFERENCES:
patent: 3811183 (1974-05-01), Celling
patent: 4567505 (1986-01-01), Pease et al.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4871921 (1989-10-01), Gurnee
patent: 5120678 (1992-06-01), Moore et al.
IBM Technical Disclosure Bulletin vol. 33, No. 7 Dec. 1990 Method to Shield the Exposed Sites Near a Chip During Encapsulation of C-4 Chip Joints in a Second Level Packaging Assembly.

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