Process for coating circuit boards

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

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Details

15624425, 156247, 1562737, 1562739, 1562755, 427 96, 427359, 427369, 4273855, 427487, 427553, 427581, 427595, B29C 4700

Patent

active

054436729

ABSTRACT:
A process is disclosed for coating a circuit board with a photopolymerizable material which is applied by extension at temperatures of 100.degree. to 180.degree. C. followed by distributing the material under pressure by a roller.

REFERENCES:
patent: 3469982 (1969-09-01), Celeste
patent: 3547730 (1970-12-01), Cohen et al.
patent: 4230793 (1980-10-01), Losert et al.
patent: 4983252 (1991-01-01), Masui et al.

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