Process for coated bonding wires in high lead count packages

Details Process for coated bonding wires in high lead count packages Process for coated bonding wires in high lead count packages

1995-06-28

1996-06-18

Picardat, Kevin M.

Fishing, trapping, and vermin destroying

437209, 437214, 437215, 437217, 437218, 437219, H01L 2160

Patent

active

055277420

ABSTRACT:
A transfer molded high lead count plastic semiconductor package is described. The packaged IC chip is mounted upon a suitable leadframe and the bonding pads wire bonded to the leadframe fingers. To avoid wire shorting, due to wire sweep during transfer molding, the wires are first coated with an insulative material.

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