Process for cleaving crystalline materials

Details Process for cleaving crystalline materials Process for cleaving crystalline materials

1979-09-10

1981-01-13

Whitehead, Harold D.

Stone working

Splitting, shearing, and punching

51283R, 225 2, B28D 132

Patent

active

042443482

ABSTRACT:
A process for cleaving boules of single crystal materials such as silicon or germanium into thin wafers. The process comprises creating an inward-directed radial stress concentration completely around a boule which intersects its crystallographic plane of minimum bond strength; and subsequently, triggering the cleavage of a thin wafer from the boule via a shock wave applied normal to its crystallographic plane of minimum bond strength.

REFERENCES:
patent: 2630174 (1953-03-01), Poteet
patent: 3727599 (1973-04-01), Sugiki
patent: 3901423 (1975-08-01), Hillberry
patent: 3918216 (1975-11-01), Best

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