Metal treatment – Process of modifying or maintaining internal physical... – Producing or treating layered – bonded – welded – or...
Patent
1993-08-31
1994-12-06
Dean, Richard O.
Metal treatment
Process of modifying or maintaining internal physical...
Producing or treating layered, bonded, welded, or...
148685, 228115, 228117, 228228, C22F 108
Patent
active
053707532
ABSTRACT:
A process for cladding precious metals to precipitation hardenable materials. In accordance with one aspect of the present invention, are the steps of (i) placing a precious metal layer of a first selected thickness atop a selected beryllium-copper alloy base metal strip of a second selected thickness to approximate a desired final product thickness, (ii) cold rolling the layer and strip to reduce their respective thicknesses by generally more than 50%, (iii) heating the layer and strip to a first selected temperature generally within a range of 1000.degree.-1300.degree. F., (iv) maintaining the first temperature for a first selected time to promote metallic bonding of the layer to the strip while softening the base metal, (v) pickling the layer and strip to remove surface oxides, (vi) cold rolling the layer and strip to a thickness generally 11% greater than that of the desired final product thickness, (vii) heating the layer and strip to a second selected temperature generally within a range of 1250.degree.-1400.degree. F., (viii) maintaining the second temperature for a second selected time to effect dissolution of the beryllium into the copper and growth of metallic grains in the alloy to a desired size, with minimal diffusion of the base metal into the precious metal, (ix) pickling bonded strip and layer to remove surface oxides, (x) cold rolling the layer and strip generally to the desired final product thickness, (xi) heating the layer and strip to a third selected temperature generally within a range of 500.degree.-800.degree. F. and (xii) maintaining the third temperature for a third selected time to resurrect strength, ductility and conductivity of the base metal.
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Lees Philip W.
Loewenthal William S.
Brush Wellman Inc.
Dean Richard O.
Ip Sikyin
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