Process for chemically metallizing an inorganic substrate

Details Process for chemically metallizing an inorganic substrate Process for chemically metallizing an inorganic substrate

1986-07-07

1989-05-23

Beck, Shrive

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

427 98, 427309, B05D 304

Patent

active

048329886

ABSTRACT:
Process for chemically metallizing an inorganic substrate, which is a poor conductor of electricity, e.g. a ceramic material or glass. The surface of the substrate is chemically activated so that chemical bonds are more readily formed with a subsequently applied, inorganic adhesion promoter. The adhesion promoter in turn facilitates chemical bonding with a subseqently applied metal layer, e.g. a copper layer, which is applied by a wet chemical method. The activation step and the step of applying an adhesion promoter, in combination with at least one thermal treatment, results in an adhesive strength between the metal layer and the substrate surface which equals or exceeds the adhesion strength of the surface of the substrate material.

REFERENCES:
patent: 2337460 (1943-12-01), French
patent: 3802907 (1974-04-01), Apfelbach et al.
patent: 4574094 (1986-03-01), De Luca
patent: 4604299 (1986-08-01), DeLuca
patent: 4647477 (1987-03-01), De Luca
English Abstracts of German Patent Nos. DE 3523956, DE 2533524, DE 2453192, DE 2533523, DE 2947886.
IBM Technical Disclosure Bulletin, Band 14, No. 10, March 10th, 1972, p. 2856.

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