Metal fusion bonding – Process – Plural joints
Patent
1988-01-26
1989-10-17
Wax, Robert A.
Metal fusion bonding
Process
Plural joints
228240, 252 781, 568615, B23K 3102, C09K 500
Patent
active
048741248
ABSTRACT:
Electronic components are welded or soldered or bonded to a support by arranging said components on the surface of the support and/or in holes piercing the support, in the presence of soldering materials having binding properties, and by then putting the thus-obtained assembly in contact with a perfluoropolyether in the liquid state, said perfluoropolyether having a temperature at least equal to that at which the soldering material develops its binding properties.
REFERENCES:
patent: 2500388 (1950-03-01), Simons
patent: 3054174 (1962-09-01), Rose et al.
patent: 3242218 (1966-03-01), Miller
patent: 3322826 (1967-05-01), Moore
patent: 3388465 (1968-06-01), Johnston
patent: 3665041 (1972-05-01), Sianesi et al.
patent: 3825994 (1974-07-01), Coleman
patent: 3866307 (1975-02-01), Piahl et al.
patent: 4149016 (1979-04-01), Toy et al.
patent: 4334646 (1982-06-01), Campbell
patent: 4549686 (1985-10-01), Sargent et al.
C. J. Brierley et al. Techniques for Soldering Surface Mounted Devices to Printed Circuit Boards, in "Brazing and Soldering", n. 7, Autumn 1984, pp. 25-30.
D. Schoenthaler, "Solder Fusing with Heated Liquids", in Welding Research Supplement, Nov. 1974, pp. 498 s-509 s.
Briggs Stuart
Flabbi Luciano
Johns Ken W. E.
Montedison S.p.A.
Wax Robert A.
LandOfFree
Process for carrying out the soldering of electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for carrying out the soldering of electronic components , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for carrying out the soldering of electronic components will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1739197