Process for bonding two substrates together with a one-part mois

Details Process for bonding two substrates together with a one-part mois Process for bonding two substrates together with a one-part mois

1997-05-19

1999-11-02

Gallagher, John J

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156108, 523205, 523207, 525131, C09J 400

Patent

active

059763051

ABSTRACT:
The invention is a process for bonding two substrates together which comprises contacting an adhesive composition comprising a polyurethane prepolymer comprising the reaction product of: A) a polyisocyanate; B) one or more compounds or polymers having isocyanate-reactive moieties; C) a dispersion triol containing from about 10 to about 60 percent by weight based on the dispersion of particles of an organic polymer which is nonreactive with the polyols and polyisocyanates having a particle size of from about 5 to about 50 microns; wherein the prepolymer has a free isocyanate content of from about 0.8 to about 2.2 percent; with at least one of the substrates and contacting the substrates together along the portion of the substrate(s) to which the adhesive has been applied before the adhesive applied cures and allowing the adhesive to cure and bond the substrates together.

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