Process for bonding titanium, tantalum, and alloys thereof

Details Process for bonding titanium, tantalum, and alloys thereof Process for bonding titanium, tantalum, and alloys thereof

1975-03-27

1977-03-15

Smith, Al Lawrence

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

228263, B23K 120

Patent

active

040119815

ABSTRACT:
A method of bonding film-forming metals and their alloys has been developed. The method comprises applying a first coating of a metal, compound, or alloy of the platinum metal group to the film-forming metal. A second coating of copper is then applied to the first coating. A second metal, such as steel, can then be readily soldered to the copper coating to form a strong, durable bond.
This bonding method can be used, for example, to solder a titanium screen or mesh to an electroconductive metal in the assembly of electrolytic cells for the production of chlorine or oxychlorine compounds.

REFERENCES:
patent: 3006069 (1967-10-01), Rhoads et al.
patent: 3107756 (1963-10-01), Gallet
patent: 3339267 (1967-09-01), Bronnes et al.
patent: 3393446 (1968-07-01), Hughes et al.
patent: 3497425 (1970-02-01), Cotton et al.
patent: 3862488 (1975-01-01), Pessell et al.

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