Process for bonding substrates or parts and system including...

Details Process for bonding substrates or parts and system including... Process for bonding substrates or parts and system including...

2002-11-13

2008-10-07

Maki, Steven D (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S331600, C428S522000, C502S167000, C526S297000, C526S298000

Reexamination Certificate

active

07431793

ABSTRACT:
An activator composition for accelerating hardening and achieving cure-through-volume of cyanoacrylate adhesives) comprising; (a) one or more compounds selected from the group consisting of :(i) pyrazine; or a pyrazine derivative; said pyrazine derivative being pyrazine substituted with at least one electron-releasing group; (ii) pyridine N oxides substituted with at least one electron-releasing group; or (iii) 2,6 pyridines being pyridines substituted in the 2- and 6-positions by substituents, at least one of the substituents being electron-releasing provided that both substituents are not methyl; and (b) a volatile solvent carrier for the compound.

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