Process for bonding semiconductor chip

Details Process for bonding semiconductor chip Process for bonding semiconductor chip

1996-11-14

1999-01-12

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

427 96, 29740, H01L 2408

Patent

active

058581499

ABSTRACT:
An improved process for bonding a semiconductor chip to a substrate is disclosed. In the process, a gold bump is formed on an aluminum bond pad of the chip thus forming a flip chip. A screen with an opening is placed on the substrate prior to dotting insulating epoxy on the opening. The epoxy is bladed with a printing blade thus forming an epoxy layer having a predetermined area and uniform thickness. The flip chip is, thereafter, placed on the substrate such that the gold bump is brought into electrical contact with a lead finger of the substrate through thermocompression bonding. Then the chip and substrate are put in an oven in order to permanently cure the epoxy layer. It is preferable to precure the epoxy layer prior to the permanent curing step thereby allowing thermal stress to be distributed to both the gold bump and the precured epoxy layer.

REFERENCES:
patent: 5128746 (1992-07-01), Pennisi et al.
patent: 5353498 (1994-10-01), Fillion et al.

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