Metal fusion bonding – Process – Diffusion type
Patent
1997-07-22
2000-08-08
Ryan, Patrick
Metal fusion bonding
Process
Diffusion type
228193, 2282341, 228245, 228249, B23K 2002, B23K 3112
Patent
active
060988711
ABSTRACT:
The present invention relates to a process for joining two metal members together. The process comprises the steps of providing two parent metal members to be joined and a prealloyed interlayer foil having a melting point depressant; creating a joint interface by positioning the foil between two spaced apart surfaces of the two parent metal members to be joined together; applying a load substantially transverse to the joint interface which does not cause deformation of the surfaces; and applying localized rapid heating in the area of the joint interface at a temperature sufficient to effect bonding of the two metallic members while causing little or no degradation of microstructural or mechanical properties of the parent metal and a coarsening of grain size in rim portions of the metal members.
REFERENCES:
patent: 3678570 (1972-07-01), Paulonis et al.
patent: 3753794 (1973-08-01), Paulonis et al.
patent: 4608094 (1986-08-01), Miller et al.
patent: 4614296 (1986-09-01), Lesgourgues
patent: 4700881 (1987-10-01), Ryan
patent: 4795078 (1989-01-01), Kuroki et al.
patent: 4820124 (1989-04-01), Fried
patent: 4909859 (1990-03-01), Nazmy et al.
patent: 4919323 (1990-04-01), Mahoney et al.
patent: 5005756 (1991-04-01), Muggeo et al.
patent: 5061324 (1991-10-01), Chang
patent: 5100050 (1992-03-01), Krueger et al.
patent: 5106010 (1992-04-01), Stueber et al.
patent: 5118028 (1992-06-01), Ogawa et al.
patent: 5131961 (1992-07-01), Sato et al.
patent: 5145105 (1992-09-01), Floroski et al.
patent: 5176499 (1993-01-01), Damlis et al.
patent: 5272809 (1993-12-01), Robertson et al.
patent: 5273708 (1993-12-01), Freeman
patent: 5312497 (1994-05-01), Mathey
patent: 5374319 (1994-12-01), Stueber et al.
patent: 5413752 (1995-05-01), Kissinger et al.
patent: 5571345 (1996-11-01), Ganesh et al.
patent: 5584428 (1996-12-01), Satoh et al.
patent: 5699955 (1997-12-01), Shimizu et al.
"Welding Metallurgy", Linnert, vol. 1, p. 878, 1994.
Barone J. Carter
Cairo Ronald R.
Robertson John M.
Stewart Dennis C.
Ryan Patrick
Stoner Kiley
United Technologies Corporation
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