Process for bonding films

Details Process for bonding films Process for bonding films

1982-07-15

1984-03-13

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562755, 1562757, 1563073, 1563314, 1563317, 20415923, 4284231, 528 75, B32B 3100

Patent

active

044365705

ABSTRACT:
A film is bonded to a substrate by applying a layer of adhesive to the film to be bonded, contacting the film with a substrate and subjecting the adhesive to high energy radiation either before, during or after the film and substrate are contacted. The adhesive layer is from 0.5 to 20 .mu.m thick. The adhesive employed is a mixture of at least one polyisocyanate and at least one compound containing both a (meth)acryloyl group and a hydroxyl group in which the equivalent ratio of hydroxyl to isocyanate groups is from 0.8 to 1 to 1.3 to 1. The substrate to which the film is to be bonded may also be a film. Composites formed in accordance with the present invention are characterized by high initial bond strengths.

REFERENCES:
patent: 3028367 (1962-04-01), O'Brien
patent: 3644569 (1972-02-01), Pietsch et al.
patent: 3759809 (1973-09-01), Carlick et al.
patent: 3783151 (1974-01-01), Carlick et al.
patent: 3823051 (1974-07-01), Chang
patent: 3891523 (1975-06-01), Hisamatsu et al.
patent: 3915935 (1975-10-01), Abraham et al.
patent: 4018333 (1977-04-01), Blackwood
patent: 4092202 (1978-05-01), Bergk et al.
patent: 4105118 (1978-08-01), Williams et al.
patent: 4367302 (1983-01-01), Le Roy et al.

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