Process for bonding current carrying elements to a substrate in

Details Process for bonding current carrying elements to a substrate in Process for bonding current carrying elements to a substrate in

1984-06-29

1987-01-06

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

2281802, 228238, B23K 120

Patent

active

046340416

ABSTRACT:
A process for bonding an I/O pin to a substrate wherein a mass of brazing material of an alloy that includes Ag and a metal selected from the group consisting of In and Sn and mixtures thereof, that exhibit a mushy zone over a predetermined range, is placed between a pin pad and the bonding surface of an I/O pin, where the diameter of the pin pad exceeds the diameter of the bonding surface of the pin by at least 0.01 inches, heating the resultant assembly to a brazing temperature within the predetermined range to form a mushy state of the brazing material while applying pressure to the pin, and cooling the assembly.

REFERENCES:
patent: 2606362 (1917-08-01), Martin
patent: 3680198 (1972-08-01), Wood
patent: 4182628 (1980-01-01), D'Silva
patent: 4418857 (1983-12-01), Ainslie et al.
patent: 4488673 (1984-12-01), Hopper, Jr.
patent: 4518112 (1985-05-01), Miller et al.

Affiliated with

Also associated with

Rating

Process for bonding current carrying elements to a substrate in does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for bonding current carrying elements to a substrate in , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for bonding current carrying elements to a substrate in will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-678212