Process for bonding contaminated substrates

Details Process for bonding contaminated substrates Process for bonding contaminated substrates

2005-03-29

2005-03-29

Sells, James (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S073600, C156S281000, C156S307300

Reexamination Certificate

active

06872269

ABSTRACT:
The introduction of vibration energy such as ultrasound into an uncured adhesive matrix during and/or after the joining of substrates leads to the effective dissolution and/or dispersion of adhesion-reducing contamination of the substrate surfaces into the adhesive matrix. In many cases, this can reduce the cost of expensive cleaning processes or quality control measures.

REFERENCES:
patent: 4732633 (1988-03-01), Pokorny
patent: 4824500 (1989-04-01), White et al.
patent: 4905530 (1990-03-01), Stehle et al.
patent: 5084532 (1992-01-01), Schenkel
patent: 5259908 (1993-11-01), Buecken et al.
patent: 5582858 (1996-12-01), Adamopoulos et al.
patent: 6004425 (1999-12-01), Born et al.
patent: 6015865 (2000-01-01), Blank et al.
patent: 6361643 (2002-03-01), Born et al.
patent: 6448338 (2002-09-01), Born et al.
patent: 20030187154 (2003-10-01), Schoenfeld et al.
patent: 2 346 634 (2000-04-01), None
patent: 2 355 611 (2000-06-01), None
patent: 2 000 569 (2001-05-01), None
patent: 0 369 165 (1990-05-01), None
patent: 0 365 715 (1993-06-01), None
patent: 0 363 892 (1993-08-01), None
patent: 0 354 498 (1999-10-01), None
patent: WO 9300381 (1993-01-01), None
patent: WO 9616136 (1996-05-01), None
patent: WO 9623040 (1996-08-01), None
patent: WO9903946 (1999-01-01), None
patent: WO 0020483 (2000-04-01), None
patent: WO 0037554 (2000-06-01), None
patent: WO 0194492 (2001-12-01), None

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