Process for bonding circuit substrates using conductive particle

Details Process for bonding circuit substrates using conductive particle Process for bonding circuit substrates using conductive particle

1996-04-24

1998-12-08

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438613, H01L 21288, H01L 2158, H01L 2160

Patent

active

058468536

ABSTRACT:
A circuit substrate connection method for assuring to connect the semiconductor parts or sub-circuit substrate to a main circuit substrate such as liquid crystal display panel by avoiding a short between the electrodes on the same substrate. In the present invention, photosensitive resin including conductive particulates is painted on the transparent circuit substrate, and a light is radiated from the bottom of the main circuit substrate. As the electrode of the circuit substrate shields the light, the conductive particulates are removed together with the photosensitive resin other than on the electrode by developing the main circuit substrate. Further, in the present invention, the photosensitivity resin is painted on the transparent main circuit substrate, the photosensitivity resin on the electrode on the main circuit substrate are removed, the conductive particulates are filled in the removed portion, and thus only the conductive particulates are arranged only on the electrodes.

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M. Masuda, et al, "Chip on Glass Technology for Large Capacity & High Resolution LCD" IEMT 1989 Proceedings pp. 57-60.
Hisashi Atarashi, et al "Chip on Glass Technology using Conductiv Particles & Lighsetting Adhesives" IMC 1990 Proceedings pp. 190-195.

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