Process for bonding circuit modules onto a thin-film circuit

Details Process for bonding circuit modules onto a thin-film circuit Process for bonding circuit modules onto a thin-film circuit

1977-09-08

1980-01-22

Husar, Francis S.

Metal fusion bonding

Process

Plural joints

219 85BM, 228212, B29K 3102

Patent

active

041846230

ABSTRACT:
A circuit module is mounted on a flexible substrate, forming what is usually referred to as a micropack. This substrate has soldered conducting paths that are provided with solder spots at the sites where they shall be bonded with the conducting paths of a thin-film hybrid circuit. the micropack is inserted onto the hybrid circuit with a pair of vacuum forceps or tweezers, and adjusted and pressed into the conducting paths of the hybrid circuit under the action of the pins of a pressure plate or clamp. At the same time, the conducting paths of the micropack are bonded with the conducting paths of the hybrid circuit through infrared irradiation.

REFERENCES:
patent: 2399824 (1946-05-01), Pressman
patent: 3588425 (1971-06-01), Erickson
patent: 3717743 (1973-02-01), Costello
patent: 3791018 (1974-02-01), Johnston et al.
patent: 3838984 (1974-10-01), Crane et al.
patent: 3905537 (1975-09-01), Schmehl

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