Process for bonding a cover to a substrate

Details Process for bonding a cover to a substrate Process for bonding a cover to a substrate

1996-11-22

1999-02-09

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156282, 156222, B32B 3300, B29C 6548

Patent

active

058688900

ABSTRACT:
A process for making a composite substrate with cover utilizes heated dies of a forming tool to deform and heat the substrate. The heated substrate is then placed in a marriage tool having a room temperature lower die for receiving the substrate, and a heated upper die. A cover material layer is placed over the substrate and the marriage tool is closed. The cover material includes a heat activatable adhesive and with the marriage tool closed, the heat from the upper die adheres the cover material layer to the substrate while the room temperature die cools the substrate. In this way, when the marriage tool is opened, the composite structure can be removed without deformation.

REFERENCES:
patent: 4132581 (1979-01-01), Swartz
patent: 4983247 (1991-01-01), Kim
patent: 5134014 (1992-07-01), Zaima et al.
EPO Search Report in 97309356--Mar. 31, 1998.

Affiliated with

Also associated with

Rating

Process for bonding a cover to a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for bonding a cover to a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for bonding a cover to a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1945977