Coating processes – With pretreatment of the base – Preapplied reactant or reaction promoter or hardener
Patent
1984-12-10
1987-05-19
Childs, Sadie L.
Coating processes
With pretreatment of the base
Preapplied reactant or reaction promoter or hardener
427 98, 427305, 427309, 427404, B05D 304
Patent
active
046667440
ABSTRACT:
A process for avoiding blister formation between a metal layer which is electrolessly deposited on a surface of a ceramic substrate and the substrate. The substrate is adhesion promoted with an alkali metal composition containing between 0.35 and 0.9 mole fraction alkali metal compound, and water in an amount which is sufficient to lower the melting temperature of the composition to between 145.degree. and 240.degree. C. and adhesion promote the ceramic surface with the molten composition in a time period between 1 and 200 minutes. Thereafter, the adhesion promoted ceramic surface may be activated to render it receptive to electroless metal deposition. The treated ceramic surface is coated free of blisters using an electroless metal deposition bath with an adherent, metal layer having a thickness greater than 5 micrometers.
REFERENCES:
patent: 3296012 (1967-01-01), Stalnecker
patent: 3628999 (1971-12-01), Schneble et al.
patent: 3671291 (1972-06-01), Miller et al.
patent: 3672986 (1972-06-01), Schneble et al.
patent: 3690921 (1972-09-01), Elmore
patent: 3772056 (1973-11-01), Polichette et al.
patent: 3772078 (1973-11-01), Polichette et al.
patent: 3925578 (1975-12-01), Polichette et al.
patent: 3930963 (1976-01-01), Polichette et al.
patent: 3959547 (1976-05-01), Polichette et al.
patent: 3993802 (1976-11-01), Polichette et al.
patent: 3994727 (1976-11-01), Polichette et al.
patent: 4046620 (1977-09-01), Andrascek et al.
patent: 4428986 (1984-01-01), Schachameyer
Baudrand, "Cleaning & Preparation of Ceramic and Metallized Ceramic Materials for Plating", Plating & Surface Finishing, pp. 72-75, Oct. 1984.
Jorgensen et al, "Copper Plating Process for Metallizing Alumina" International Society for Hybrid & Microelectronics, Sep. 1984.
Ameen et al, "Etching of High Alumina Ceramics to Promote Copper Adhesion", pp. 1518-1522, J. Electrochem Soc. Nov. 1973.
DeLuca Michael A.
McCormack John F.
Oleske Peter J.
Childs Sadie L.
Kollmorgen Technologies Corporation
LandOfFree
Process for avoiding blister formation in electroless metallizat does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for avoiding blister formation in electroless metallizat, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for avoiding blister formation in electroless metallizat will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1563808