Process for attaching optical fiber to semiconductor die

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156293, 156322, 357 17, G02B 726, H01L 3112

Patent

active

043291902

ABSTRACT:
A process is described for attaching optical fiber to a semiconductor die in which a first droplet of adhesive is applied to the die and partially gelled to form a cushion for receiving the end of the optical fiber to be attached thereto.

REFERENCES:
patent: 4058821 (1977-11-01), Miyoshi et al.
patent: 4100562 (1978-07-01), Sugawara et al.

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