Process for attaching components with near-zero standoff to...

Metal fusion bonding – Process – Plural joints

Reexamination Certificate

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C438S119000

Reexamination Certificate

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07918381

ABSTRACT:
The present invention relates to a method and apparatus for mounting electrical components to electric circuit boards. Specifically, the present invention relates to a method for mounting electrical components having near-zero standoff height to electrical printed circuit boards.

REFERENCES:
patent: 3439235 (1969-04-01), Lanzl et al.
patent: 5953814 (1999-09-01), Sozansky et al.
patent: 2003/0096453 (2003-05-01), Wang et al.

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