Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2011-04-05
2011-04-05
Ward, Jessica L (Department: 1735)
Metal fusion bonding
Process
Plural joints
C438S119000
Reexamination Certificate
active
07918381
ABSTRACT:
The present invention relates to a method and apparatus for mounting electrical components to electric circuit boards. Specifically, the present invention relates to a method for mounting electrical components having near-zero standoff height to electrical printed circuit boards.
REFERENCES:
patent: 3439235 (1969-04-01), Lanzl et al.
patent: 5953814 (1999-09-01), Sozansky et al.
patent: 2003/0096453 (2003-05-01), Wang et al.
Hunt Joel D.
Ihms David W.
Witty Michael R.
D'Aniello Nicholas P
Delphi Technologies Inc.
Funke Jimmy L.
Ward Jessica L
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