Process for attaching a lead member to a semiconductor device

Details Process for attaching a lead member to a semiconductor device Process for attaching a lead member to a semiconductor device

1974-04-24

1976-01-06

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29589, 228219, 357 67, B01J 1700

Patent

active

039303063

ABSTRACT:
A thermally and electrically conductive metal lead member is joined to the refractory metal contact member of a semiconductor device using a brazing alloy comprising on a weight basis about 80-89 percent copper, about 5-15 percent silver, and about 4-6 percent phosphorus. The contact member/semiconductor joint may be formed in an inert atmosphere at the same time and at the same temperature as the contact member/lead member joint.

REFERENCES:
patent: 3378914 (1968-04-01), Miller
patent: 3844029 (1974-10-01), Dibugnara
Brazing Manual, published by American Welding Society, Inc., Copyright 1963, pp. 39 and 40.

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