Process for assembly of a metal can on a substrate bearing an in

Details Process for assembly of a metal can on a substrate bearing an in Process for assembly of a metal can on a substrate bearing an in

1991-10-10

1993-04-13

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228124, 427229, 427404, 445 44, H01J 926, B23K 120

Patent

active

052014568

ABSTRACT:
The invention concerns a process for assembly of two layers constituted of materials having different mechanical properties, and its application to hermetic enclosure of hybrid circuits.
The process according to the invention to assemble a layer of a material M.sub.1 and a layer of a material M.sub.2 is characterized by the fact that it consists in interposing between the two layers an intermediate layer constituted of a mixture of the material M.sub.1 and the material M.sub.2. This mixture is preferably constituted of 25% to 75% by weight of the material M.sub.1 and 75% to 25% by weight of the material M.sub.2.
The process according to the invention is particularly useful for the enclosure of integrated circuits and more particularly hybrid circuits, during the assembly of the metal can on the ceramic substrate bearing the circuit.

REFERENCES:
patent: 3020182 (1962-02-01), Daniels
patent: 4338380 (1982-07-01), Erickson et al.
patent: 4704626 (1987-11-01), Mahulikar et al.
Patent Abstracts of Japan, vol. 011, No. 023 (E-473) Jan. 22, 1987 & JP-A-61 193473 27 aout 1986.
Patent Abstracts of Japan, vol. 012, No. 111 (E-598) Apr. 8, 1988 & JP-A-62 241356 Oct. 22, 1987.
Patent Abstracts of Japan, vol. 009, No. 263 (E-351) Oct. 19, 1985 & Jp-A-60 110156 Jun. 15, 1985.

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