Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1993-10-14
1996-04-23
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 98, 29830, 156299, 156305, B05D 512
Patent
active
055101399
ABSTRACT:
In a process for assembly and bonding of electric and/or electronic components (3), provided with metal connections (11), on an insulating support (1) to be provided with strip conductors, it is provided, to increase the economic efficiency, that a catalyst (7) for currentless metal deposition is applied on support (1) first in the area of the strip conductor structure, that components (2) are positioned with their metal connections (11) on the assigned strip conductor points of support (1) and that then, by currentless metal deposition from a chemical metallization bath, bonding (13, 14) of metal connections (11) is performed simultaneously with the formation of metallic strip conductors (5).
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Deissner Erich
Hammond Jonathan D. H.
Meier Dieter
AMEG Additive Metallisierung-Entwicklunge-und Anwendungssesellsh
Beck Shrive
Talbot Brian K.
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