Process for assembling smaller scanning or printing arrays toget

Details Process for assembling smaller scanning or printing arrays toget Process for assembling smaller scanning or printing arrays toget

1989-10-16

1990-12-11

Ball, Michael W.

Specialized metallurgical processes, compositions for use therei

1562739, 1562755, 1562757, 156295, 156297, 358 43, B32B 3100

Patent

active

049768026

ABSTRACT:
A process for fabricating a full width scanning or printing array in which plural smaller scanning or printing chips are bonded end-to-end onto an glass substrate using a photocurable adhesive to form a subassembly, following which the subassembly is inverted and joined to a second substrate having a conductive surface using a conductive heat activated adhesive.

REFERENCES:
patent: 4321747 (1982-03-01), Takemura
patent: 4383018 (1983-05-01), Martin
patent: 4388128 (1983-06-01), Ogawa et al.
patent: 4523102 (1985-06-01), Kazufumi et al.
patent: 4661191 (1987-04-01), Kamio et al.
patent: 4698113 (1987-10-01), Ogawa
patent: 4735671 (1988-04-01), Stoffel
patent: 4814296 (1989-03-01), Jedlicka et al.

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