Process for assembling smaller arrays together to form a longer

Details Process for assembling smaller arrays together to form a longer Process for assembling smaller arrays together to form a longer

1989-03-30

1990-09-04

Cashion, Jr., Merrell C.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29467, 29740, 1562757, 156297, 156299, 156562, B32B 3120, B32B 3128

Patent

active

049541978

ABSTRACT:
A process for fabricating a full width array in which plural smaller chips are bonded end-to-end onto the metallic covering of an elongated substrate by an electrically conductive heat activated adhesive, in which a photocurable adhesive is used to temporarily retain the smaller chips in position while the heat activated adhesive is cured, the process accommodating the inability to cure the photocurable adhesive through the opaque chips and substrate covering by locating the photocurable adhesive so that it extends outside of the boundary of the smaller chips and forms an adhesive fillet or bridge between one side of the smaller chips and the substrate when cured by ultraviolet light.
In an alternate embodiment, the photocurable adhesive is located within the boundary of the smaller chips initially but is squeezed out from below the smaller chips to form the exposed adhesive bridge when the smaller chips are placed on the substrate.

REFERENCES:
patent: 4044187 (1977-08-01), Kremkau
patent: 4222635 (1980-09-01), Julke
patent: 4388128 (1983-06-01), Ogawa et al.
patent: 4523102 (1985-06-01), Kazufumi et al.
patent: 4661191 (1987-04-01), Kamio et al.
patent: 4690391 (1987-09-01), Stoffel
patent: 4698113 (1987-10-01), Ogawa
patent: 4735671 (1988-04-01), Stoffel

Affiliated with

Also associated with

Rating

Process for assembling smaller arrays together to form a longer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for assembling smaller arrays together to form a longer , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for assembling smaller arrays together to form a longer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-439620