Process for assembling integrated circuit packages

Details Process for assembling integrated circuit packages Process for assembling integrated circuit packages

1987-05-26

1988-04-12

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

174 52FP, 357 70, H01R 4300

Patent

active

047365200

ABSTRACT:
Automatic manufacture of integrated circuit packages including a leadless chip carrier is facilitated by providing, in strip form, flexible tape circuitry having a dielectric layer and a conductive layer. Through selective etching, regularly spaced central openings are formed in the strip for subsequent placement of the leadless chip carriers. The arms are formed in the conductive layer and extend into the openings. Members are formed in the dielectric layer around each opening. A leadless chip carrier is placed in an opening and its pads are bonded to the arms. With the chip carrier thus secured to the strip, its position is controlled by the strip drive means which moves each chip carrier to assembly and testing stations. Electrical testing is accomplished with probes adapted to contact the arms. Temperature cycling and other mechanical tests also are conducted with the chip carrier attached to the tape. After testing, the finished IC packages can be removed by severing the arms and members from the remainder of the strip. Alternatively, the strip, with chip carriers attached, is wound onto a reel for shipment or storage.

REFERENCES:
patent: 3628105 (1971-12-01), Sakai et al.
patent: 3930115 (1975-12-01), Uden et al.
patent: 4063993 (1977-12-01), Burns
patent: 4079511 (1978-03-01), Grabbe
patent: 4142287 (1979-03-01), Grabbe
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 4460825 (1984-07-01), Haghiri-Tehrani et al.

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